Ceramic Dip Package

Cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up.

Ceramic dip package. Minimum pin count is 28 while the maximum pin count is limited to the manufacturer s capabilities. Medical and healthcare. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Cerdip ceramic q ceramic dual inline package glass seal package drawing q filter packages by entering lead count or product description into the search box below.

Another example of a ceramic. Spst x 4 two complementary pairs per package. Kyocera offers a wide variety of standard ceramic packages including ceramic dual inline packages c dip ceramic small outline packages c sop ceramic pin grid array packages c pga ceramic quad flat packages c qfp ceramic quad flat j leaded packages c qfj and ceramic quad flat non leaded packages c qfn. Material properties process flow.

Non standard dip with smaller 0 07 in 1 78 mm pin spacing. Ceramic substrates for probe cards. 14 lead cerdip q 14 pdf. Standard packages and lids for device evaluation.

And having a row spacing associated with body width varies depending on lead counts with 0 3 in. Packages come in many forms including dip dual inline sip single inline and pga pin grid array pin insertion types and surface mount types including j lead flat lead gull wing leadless bga ball grid array lga land grid array csp chip size package and other types. Spst x 4 two complementary pairs per package. 7 62 mm or 0 6 inch 15 24 mm.

Standard dip with 0 1 in 2 54 mm pin spacing rows 0 3 in 7 62 mm apart. Ceramic packages for large scale integration lsi devices. Both passive or active devices may be found using ceramic packages. The most commonly found ceramic dip packages have an inter lead spacing or lead pitch of 0 1 inch 2 54 mm.

Medical and healthcare.