Ceramic Cavity Package

If saving time and reducing cost is important for your ceramic air cavity packages talk to one of our experts about the fully assembled ca pack package solution.

Ceramic cavity package. Hermetic or vacuum sealing is typically applied to ensure device quality. The traditional package for rf power transistors is the air cavity package with a ceramic lid. Ca pack packages convenient pre assembled ceramic package. Available in larger sizes up to a cavity of 16 5 mm x 6 1 mm ni780 header unmetallized frames enable shorter lead times and reduce manufacturing complexity.

Ceramic pin grid array packages cpga cpgas are typically a square ceramic multilayer package with an array of pins brazed onto either the front side of the package cavity down or on the backside of the package cavity up. These ceramic packages are suitable for use in sensors due to the high modulus of elasticity and low coefficient of thermal expansion of ceramic materials. The flange or heatsink material has evolved over the years and the most commonly used material today is cpc cu mo70cu cu a laminate of copper and coppermolybdenum. Kyocera provides miniaturized surface mount ceramic packages with cavity structures available on both top and bottom.

Ceramic air cavity packages proven performance for wireless applications.